KLA Tencor TeraScan cutaway

Deep ultraviolet (DUV) reticle inspection system.

Tencor TeraScan reticle inspection

KLA Tencor TeraScan

Deep Ultraviolet (DUV) Reticle Inspection System used in Silicon Chip (wafer fab) Manufacturing

TeraScan detail

Image Data

  • Client: KLA Tencor Milpitas, CA
  • Agency: N/A
  • Format: Digital (Illustrator & Photoshop)
  • Use: Collateral
  • Photography: N/A
  • Alt. View: TeraStar 5XX

KLA Tencor's TeraScan is a defect detection scanner that evaluates masks, or 'reticles' used in the microelectronics and semiconductor fabrication (wafer fab) process, insuring that they are error-free. The TeraScan in this cutaway illustration uses a detection method known as 'deep ultraviolet' (DUV) reticle inspection to evaluate various reticle types such as embedded phase shift, chrome-on-glass or alternating phase shift reticles which may contain quartz defects. KLA-Tencor Corporation is located in Milpitas, California.

All Images Copyright © Kevin Hulsey, Kevin Hulsey Illustration, Inc. (KHulsey.com), all rights reserved.